Treffer: 2-D Fluid Simulation Approach for Miniwave Soldering

Title:
2-D Fluid Simulation Approach for Miniwave Soldering
Authors:
Seidel, Reinhardt, Sippel, Marcel, Franke, Jorg
Source:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1785-1790 May, 2022
Relation:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Database:
IEEE Xplore Digital Library