Treffer: Integrated Microfluidic Cooling of Heterogeneous HBM–GPU Package With Die Height Difference
Title:
Integrated Microfluidic Cooling of Heterogeneous HBM–GPU Package With Die Height Difference
Authors:
Source:
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(11):2429-2438 Nov, 2025
Database:
IEEE Xplore Digital Library