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Treffer: Development of Multimodal Metal Particle Pastes Using Computer Simulation Technology

Title:
Development of Multimodal Metal Particle Pastes Using Computer Simulation Technology
Authors:
Zhu, Zhihong, Miu, Junwei, Gao, Fei, Zhao, Siqi, Liu, Yu, Li, Wanli
Source:
2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024
Relation:
2024 25th International Conference on Electronic Packaging Technology (ICEPT)
Database:
IEEE Xplore Digital Library