Treffer: Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Title:
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Authors:
Resource Type:
eBook.
Subjects:
Database:
eBook Index
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Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges.