Kim, M.H. und Kim, T.S. (2024) „Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks.“, Electronics (2079-9292), 13(7), S. 1360-1391. doi:10.3390/electronics13071360.
Chicago Manual of Style 17th edition (full note)Kim, Moo Hyun, und Tae Seon Kim. „Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks.“. Electronics (2079-9292) 13, Nr. 7 (1. April 2024): 1360-91. https://doi.org/10.3390/electronics13071360.
American Psychological Association 7th editionKim, M. H., & Kim, T. S. (2024). Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks. Electronics (2079-9292), 13(7), 1360-1391. https://doi.org/10.3390/electronics13071360
Modern Language Association 9th editionKim, M. H., und T. S. Kim. „Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks.“. Electronics (2079-9292), Bd. 13, Nr. 7, April 2024, S. 1360-91, https://doi.org/10.3390/electronics13071360.
ISO-690 (author-date, Deutsch)KIM, Moo Hyun und Tae Seon KIM, 2024. Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks. Electronics (2079-9292). 1 April 2024. Bd. 13, Nr. 7, S. 1360-1391. DOI 10.3390/electronics13071360